Glob Top Sealing Compound
Sealing compounds and encapsulants are often used in electronics as so-called glob tops to protect electronic components. They protect components from moisture, dust, dirt and solvents. Glob tops also protect sensitive components from mechanical strain and scratching.
All Panacol sealing compounds and encapsulants are made without solvent and many have a low ionic content of less than 10 ppm Na+, K+, Cl- and Br-. They therefore provide perfect protection from internal corrosion and reduce local voltaic coupling.
Many sealing compounds are UV-curing, allowing rapid setting in just a few seconds. This makes them suitable for encapsulating components in fully automated high-volume production.
Thermally curing sealing compounds, on the other hand, have the advantage of curing even in shaded areas that the UV light cannot reach. Glob tops with black pigmentation, which are used as covers or coatings, can normally only be heat-cured.
After curing, all glob top sealing compounds withstand short-term temperatures of up to 280°C and remain unaffected by reflow processes. Panacol’s glob top adhesives are easy to process, highly flexible and have a high peel and shear strength.
The table below lists a selection of sealing compounds suitable for glob tops. Further products and custom solutions are available on request.