Flip Chip underfill
Panacol Vitralit underfills are used in devices such as FC CSPs and FC BGAs for ASICs. These fast flow materials permeate easily under large die. Offering excellent adhesion when used with a variety of no-clean fluxes, these underfills will not crack after thermal shock or thermal cycling. The Vitralit underfills offer many processing advantages such as fast flow, fast cure and long pot life.
Vitralit underfill advantages
- UV and/or heat curable
- Snap cure at low temperatures
- Low ionic content < 10ppm
- Storage 6 months at 5°C
- 2 months Potlife at 25°C
- Fast flow
- Nano-filler for very low CTE available!!
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