Encapsulation of Electronic Components
Epoxy and acrylate resin based sealing and molding compounds are often used in electronics to protect electronic components, semiconductors and subassemblies. The encapsulation protects components from moisture, dust, dirt and solvents. Used to fill cavities or encapsulate components, sealing compounds also provide effective protection from mechanical stress.
All Panacol sealing compounds are made without solvent and many have a low ionic content of less than 10 ppm Na+, K+, Cl- and Br-. They therefore provide perfect protection from internal corrosion and reduce local voltaic coupling.
Many sealing compounds are UV-curing, allowing rapid setting in just a few seconds. This makes them suitable for encapsulating components in fully automated high-volume production.
Thermally curing sealing compounds, on the other hand, have the advantage of curing even in dark areas that the UV light cannot reach. These encapsulants are also available in black colour for use as a coating or covering.
The table below lists a selection of sealing and molding compounds from Panacol. Further products and custom solutions are available on request.