Adhesives for Applications in Optoelectronics
Optoelectronic devices are electrical-to-optical or optical-to-electrical transducers, which require specially formulated adhesives for manufacturing.
Transparent and non-yellowing adhesives are used, for instance, as glob tops of diodes or LEDs. Panacol’s adhesives are filled with specially designed nano particles, which have the benefit of not impairing the optical properties while at the same time significantly improving the adhesive’s mechanical properties.
To fix and align the photo diodes of collectors and optical fibres for transmitting optical signals Panacol provides a range of epoxy-based adhesives.
All these UV- or thermally curing adhesives feature low thermal expansion and thus reducing the stress on the delicate underlying electronic substrates. Panacol’s adhesives ensure maximum media and chemical resistance. Additionally, the optoelectronics adhesives are specially formulated to have a low shrinkage once they are cured.
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The table below lists a selection of adhesives that are suitable for applications in optoelectronics. Further products and custom solutions are available on request.
To download the technical datasheets (TDS) please click on the adhesive name.
Adhesive | Application | Viscosity [mPas] | Base | Curing* |
---|---|---|---|---|
Vitralit® 1605 |
encapsulation of electronic components optical cement lens bonding cement glass bonding potting material |
200-400 | epoxy |
UV secondary heat cure |
Vitralit® 1527 |
optical cement lens bonding cement glass bonding potting material |
600-1,250 | epoxy | UV |
Vitralit® 1528 |
optical cement lens bonding cement glass bonding potting material |
350-850 | epoxy |
UV secondary heat cure |
Vitralit® UC 1618 |
optical cement lens bonding cement |
500-1,000 | epoxy |
UV secondary heat cure |
Vitralit® UC 1619 |
optical cement lens bonding cement |
3,000-5,500 | epoxy |
UV secondary heat cure |
*UV = 320 - 390 nm