Bonding camera modules
In the electronics sector adhesives are used in particular for mobile phone and smartphone camera modules. This includes bonding of individual parts – such as the lens into the lens mount or the lens mount onto the camera sensor –, fixing the camera chip onto the circuit board (die attach), use of the adhesive as chip underfill, bonding low-pass filters and gluing the assembled camera modules into the device housing.
Special adhesives allow precise assembly and durable bonding of ever smaller camera module components. The adhesives used are suitable for large-scale production of camera modules and cure quickly at low temperatures.
The lenses and small modules of smartphone cameras are joined with adhesives
The table below lists a selection of adhesives that are recommended for bonding camera modules. Further products and custom solutions are available on request.
To download the technical datasheets (TDS) please click on the adhesive name.
*UV = 320 - 390 nm VIS = 405 nm