Bonding camera modules
In the electronics sector adhesives are used in particular for mobile phone and smartphone camera modules. This includes bonding of individual parts – such as the lens into the lens mount or the lens mount onto the camera sensor –, fixing the camera chip onto the circuit board (die attach), use of the adhesive as chip underfill, bonding low-pass filters and gluing the assembled camera modules into the device housing.
Special adhesives allow precise assembly and durable bonding of ever smaller camera module components. The adhesives used are suitable for large-scale production of camera modules and cure quickly at low temperatures.
The lenses and small modules of smartphone cameras are joined with adhesives
The table below lists a selection of adhesives that are recommended for bonding camera modules. Further products and custom solutions are available on request.
To download the technical datasheets (TDS) please click on the adhesive name.
| Adhesive | Viscosity [mPas] | Base | Curing* | Properties |
|---|---|---|---|---|
| Vitralit® UD 5134 | 15,000-25,000 | acrylate |
UV VIS secondary heat cure |
Acrylate-Hybrid low thermal expansion low shrinkage impact resistant dry surface grey color |
| Vitralit® UV 2113 | 19,000-32,000 (Rheometer, 25°C, 10s^-1) | acrylate |
UV VIS |
Acrylate hybrid superior strength low thermal expansion impact resistant low shrinkage resistant to soldering stress excellent flow properties |
| Vitralit® UV 2115 | 20,000-30,000 (Rheometer, 25°C, 50s^-1) | acrylate |
UV VIS |
Acrylate hybrid superior strength low thermal expansion low shrinkage impact resistant resistant to soldering stress paste-like stable and high viscous |
| Vitralit® UV 2415 | 1,500-2,500 | acrylate |
UV VIS |
High bond strength impact resistant dry surface resistant to high temperatures and chemicals |
*UV = 320 - 390 nm VIS = 405 nm