Flip Chip Underfill

Underfills are used for mechanical stabilization of flip chips. This is especially important when soldering ball grid array (BGA) chips. To reduce the coefficient of thermal expansion (CTE), the adhesives are partly filled with nano fillers.

Adhesives used as chip underfill have a capillary flow behaviour for quick and easy application. Usually dual-curing adhesives are used: the edge regions are fixed in position by curing with UV light before the shadow zones are cured thermally.

graphical representation of a PCB flip chip with adhesive as underfill

Adhesive as underfill for flip chips on PCBs

The table below provides an overview of Panacol adhesives that are used as underfill.

To download the technical datasheets (TDS) please click on the adhesive name.

Adhesive/ Underfiller Viscosity [mPas] Base Curing* Properties
Vitralit® 2655 150-300 epoxy UV
secondary heat cure
flexible
capillary flow
high ion purity
Vitralit® 2667 3,000-5,000 epoxy UV
secondary heat cure
Low thermal expansion
low ion content
No outgassing
Structalit® 5751 200-500 Epoxy Thermal Black color, fluorescent yellow, jetable, low ion content, reworkable above 150°C

*UV = 320 - 390 nm