Flip Chip Underfill

Underfills are used for mechanical stabilization of flip chips. This is especially important when soldering ball grid array (BGA) chips. To reduce the coefficient of thermal expansion (CTE), the adhesives are partly filled with nano fillers.

Adhesives used as chip underfill have a capillary flow behaviour for quick and easy application. Usually dual-curing adhesives are used: the edge regions are fixed in position by curing with UV light before the shadow zones are cured thermally.

Adhesive as underfill for flip chips on PCBs

The table below provides an overview of Panacol adhesives that are used as underfill.

To download the technical datasheets (TDS) please click on the adhesive name.

Adhesive/ Underfiller Viscosity [mPas] Base Curing* Properties
Vitralit® 2655 150-300 epoxy UV
thermal
Flexible
capillary flow
high ion purity,
Vitralit® 2667 3,000-5,000 epoxy UV
thermal
Low thermal expansion
low ion content

*UV = 320 - 390 nm