Photovoltaics and OPV

Paradigm shifts and disruptive technologies typically combine with, and often rely on generational changes. Such a shift can be seen in today’s photovoltaics development, where organic photovoltaics (OPV) is creating radically new applications in consumer electronics.  They include indoor light harvesting to extend battery life of wearables, and outdoor energy generation with performance previously unimaginable from conventional photovoltaics. The same is true for flexible electronics. Manufacturers are redefining the boundaries of volumetric form factor, functionality, and design flexibility in consumer and automotive electronics.

A critical contributor to these technology advancements has come from the advancement of bonding technologies.  Adhesives now go beyond the basic benefits of sound structural bonding and provide additional functionality to the assembly.  This has become the industry standard.  Working in conjunction with our highly valued partners and customers, Panacol has successfully developed a range of multi-functional adhesive selections for applications in OPV and flexible electronics. For OPV applications, these adhesives provide higher resistance to environmental stresses. Adhesives for barrier foil lamination optimize the critical interplay between the pretreatment, foil, stack, and adhesive.  New conductive adhesives efficiently adhere and protect electrical connections for SMD components in flexible packaging.   

In all cases, the specific requirements of the application and its assembly process are key factors to consider when making an adhesive selection. Significant benefits can be realized when an optimal pairing is achieved with the component design, assembly, (UV) adhesive properties, and the curing process. Component and process design is afforded much greater flexibility.  High throughput processes, including reel-to-reel, can be run with greater efficiency which reduces total cost of operation. Finished products can also possess more functionality and durability.

As new designs are evolving rapidly, very little standardization exists in the manufacturing of OPV. To support this evolution, adhesives must be modified or developed to meet the customers’ unique OPV design, materials, and processes. 

Adhesives for flexible photovoltaics and electronic applications

Adhesives are used for foil lamination on flexible photovoltaic cells

In the following tables you will find a selection of Panacol adhesives suitable for OPV and photovoltaic assembly applications. Other products or customized solutions are available on request.

To download the technical datasheets (TDS) please click on the adhesive name.

Adhesive Application Viscosity [mPas] Base Properties
Vitralit® E-VBB-1 Potting compound
Flexible bonding
OPV and photovoltaics
Alternative to silicone
1,300 - 1,600 (Rheometer, 25 °C, 10s^-1) acrylate High peel strength
Optically clear
Outstanding flexibility
Excellent elongation
Resistant to moisture
Vitralit® UD 1410 Plastic bonding
General bonding of various substrates
OPV Photovoltaics
1,500 - 2,000 (Rheometer, 25 °C, 10s^-1) epoxy Very good wetting properties
Very flexible, low WVTR
High Tg
Electrically insulating
Vitralit® UD 1411 Plastic bonding
General bonding of various substrates
OPV Photovoltaics
6,000 - 7,000 (Rheometer, 25 °C, 10s^-1) hybrid Very flexible, low WVTR (water vapour transmission rate)
Flexible with approved compatibility to pv materials
Elecolit® 3647-1 Die attach
Flexible printed circuits
Contacting on Flex PCBs
Conductive bonding
OPV photovoltaics
n.n. epoxy Very flexible, solvent-free
Electrically conductive
Thermally conductive
Very high adhesion to glass, various metals and plastics
Elecolit® 3648 Die attach
Flexible printed circuits
Contacting on Flex PCBs
Conductive bonding
OPV photovoltaics
10,000 – 15,000 (Rheometer 10s^-1) epoxy Very flexible, solvent-free
Electrically conductive
Thermally conductive
Very high adhesion to glass, various metals and plastics
Snap Cure
Curing with thermode possible
Structalit® 3060-1 structural bonding
die attach
OPV photovoltaics
7,000-10,000 (Rheometer, 25 °C, 10^s-1) epoxy non-conductive
high flexibility
very fast curing
very low ion content
high bond strength to several substrates