Adhesives for SMD Assembly and Reflow Soldering

Before soldering, components with pin contacts or SMDs are often bonded to the PCB with fast-curing adhesive. This allows, for example, several capacitors, electrolytic capacitors and coils to be positioned on a circuit board to prevent their falling over or sliding out of position on the PCB. The secured components can then be reflow-soldered in a single work step, which saves time and speeds up production.

Panacol’s adhesives for reflow soldering have been developed specially to cure rapidly under UV light or at heat exposure. Once cured, they can withstand short-term exposure to higher temperatures, making them suitable for reflow soldering.

On request these adhesives are also available in red colour or with fluorescent pigment to facilitate quality and application monitoring. Their red colour or fluorescence allows the bond quality of every component to be easily inspected also in mass production.

Red SMD adhesive for reflow soldering

Red dots of adhesive are easily applied via screen printing

The table below lists a selection of Panacol adhesives that are suitable for holding components and for reflow soldering. Further products and custom solutions are available on request.

To download the technical datasheets (TDS) please click on the adhesive name.

Adhesive Viscosity [mPas] Base Curing* Properties
Vitralit® 6104 VT 8,000-17,000 (Rheometer, 25°C, 10s^-1) acrylate UV
secondary heat cure
Very high adhesion to metals and sintered materials
ideal for bonding large components on circuit boards (corner bonding)
Structalit® 5604 25,000-40,000 (Rheometer, 25 °C, 10s^-1) epoxy thermal Fast curing
red color
fixing components on PCBs
SMD applications
Vitralit® UD 8055 5,000-8,000 (Rheometer, 25°C, 10s^-1) acrylate UV
moisture cure
High Tg
Fast curing
Compatible with flux
Low ion content
Vitralit® UD 8056 3,000-6,000 (Rheometer, 25°C, 10s^-1) acrylate UV / VIS High Tg, fast curing
Compatible with flux
Low ion content
Passed UL94 HB test

*UV = 320 - 390 nm