Press Releases and News
Panacol introduces new line of masking materials
Panacol has developed new UV curable masking materials for industrial processes. These masking materials are part of the Vitralit® MASK product line. They can be easily applied, cured in seconds by exposure to UV light, and then removed by a simple peel, or for those masks with higher adhesion, hot water dip and peel.
UV mask material is typically used in high value component fabrication that involves processes for surface enhancement. These processes may include acid cleaning, grit blasting, or shot peening. Component surfaces or internal cavities may need to be insulated from these processes for reasons of functionality. Masking materials are applied as temporary barriers, that are subsequently removed from the completed component after processing. Typical applications include the manufacture of turbine components, orthopedic devices or prosthesis, and other industrial component processes such as the coating of circuit boards and plastics.
The UV masking material is derived from light curable adhesive technology. Panacol’s family of UV light curable mask materials are solvent-free and can be easily applied and cured in seconds with a UV light source. The curing system may be broad spectrum UV or LED in in wavelengths of 365 or 405nm.The uncured liquid mask can be applied on components by syringe, dip, or spray. The masks are available in many viscosities to accommodate a wide variety of component configurations and applications. Both high and low viscosity masks from Panacol can be easily dispensed through spray valves onto larger surfaces. All Vitralit® MASK materials provide uniform and consistent protection from high impact particulates, hot acids, alkali solutions, plating, and paint. Vitralit® UV masks are available in green color to provide higher contrast for better visual inspection.
Removal of Panacol UV mask materials such as Vitralit® MASK 20107 or 20109 is accomplished by a simple peel, or a hot water dip and peel. A selection of Panacol UV masks, such as the new Vitralit® MASK 20116, have extremely high surface adhesion for the most rigorous processing. These UV masks are best removed through incineration. Panacol UV masking materials do not leave surface residue after peeling or incineration.
More about UV-Masks
The green colored Vitralit® MASK 20117 was applied to a metal alloy prosthesis to protect parts of the surface from grit blasting.
Panacol launches new reworkable edge bonding adhesive
Panacol has developed Structalit® 5705, a new, removable edge bonder specifically formulated for bonding consumer electronics components. In addition to reworkability, the main feature of the black adhesive is that it fluoresces yellow when excited by UV light. This significantly enhances the accuracy of in-line optical inspection systems.
Edge bonding adhesives are used to quickly secure electronic components to printed circuit boards. This fastening method offers superior protection from shock, vibration, and thermal stress. As a constructive alternative to underfill processes, edge bonding increases the impact and bending strength of BGAs and other chip packages. Edge bonding can also be preferable to underfills when flux residues are present on PCB and component surfaces.
Structalit® 5705 is a black, thermosetting epoxy resin adhesive that is characterized by its viscous flow properties and high thixotropy index. These properties enable precise placement of the adhesive with no subsequent migration. Structalit® 5705 may be dispensed using pneumatic valves, or through highly efficient, contactless jet dispense systems. This epoxy resin-based edge bonder is low in halogens, and is ideal for electronic components assembly.
A typical feature of PCB adhesives is a black coloring that is used for light blocking and concealment. Visual inspection of edge bond placement is commonly performed by manufacturers using in-line camera systems. Dark-colored, low contrast chips often present difficulties for precise optical measurement. Panacol solves this problem by incorporating a yellow fluorescence into the black Structalit® 5705. The fluorescence is excited by short wavelength light, for instance 365nm. The highly contrasting fluorescence makes it easier for manufacturers to perform in-line inspections, resulting in faster parts processing and increased throughput.
For manufacturers of electronic components, a new challenge is becoming increasingly important. Global environmental associations are successfully lobbying for legislation to minimize electronic waste. A critical step in this sustainable strategy is the ability to rework and repair individual modules on printed circuit boards. Reworkability and repair reduces the amount of electronic component scrap that must be disposed into the environment. Structalit® 5705 from Panacol provides a reworkability feature. The adhesive can be removed without damaging the bonded components. This enables faulty components to be removed, and repaired after assembly.
Structalit® 5705 edge bonding adhesive is selectively reworkable when the cured adhesive receives thermal exposure above its glass transition temperature (Tg) of 150°C. The adhesive softens, and can be manually scraped away using a small spatula or similar instrument. It is only above this critical temperature threshold that the product becomes workable. Below this temperature, Structalit® 5705 protects bonded components with reliable bond strength and consistent performance.
Another pressing need for the reworkability of bonded components stems from the current global supply chain parts shortages. Automotive and consumer electronics sectors are experiencing massive production delays, primarily from a shortage of integrated circuits (chips) and electronic board components. The ability to rework components can help to mitigate some of these shortages. Reusing components not only offers advantages for the environment, but has also become essential for maintaining current production processes caused by supply chain bottlenecks.
Structalit® 5705 edge bonding adhesive can be used in conjunction with Panacol’s reworkable underfill, Structalit® 5751. Both adhesives can be applied wet-on-wet and cured together in just one oven process step. The reworkability of both adhesives provides manufacturers with the means to repair components after assembly, and reduce electronic waste.
Download technical datasheet of Structalit® 5705
Read more about Panacol bonding solutions for SMD assembly
Black edge bonding adhesive Structalit® 5705 fluoresces brightly yellow under uv light.
New epoxy adhesive offers maximum protection for potting applications
Developed by Panacol, Structalit® 5801 is a new 2-component adhesive system that demonstrates exceptional chemical and moisture resistance after accelerated aging. This resistance makes Structalit® 5801 an ideal material for the structural bonding and potting of electronic components that require the highest level of environmental protection.
Structalit® 5801 is a black, 2-component epoxy adhesive system with a simple 2:1 mixing ratio. Curing takes place within 12 hours at room temperature. For faster processing, this adhesive can also be cured thermally, in as little as 30 minutes at a moderate temperature of 80°C. Lower temperature curing minimizes thermal stress on components, and the shorter cycle time improves productivity. This medium-viscosity adhesive blend has excellent adhesion to metals including aluminum and stainless steel. It is well suited for the structural bonding of metal frames and housings. Structalit® 5801 also exhibits very good adhesion to plastics, such as PA6 GF or PBT. This multi-substrate adhesion allows Structalit® 5801 to be used for many material combinations typically found in the consumer and automotive electronics industries.
This newly developed adhesive cures with low shrinkage, and exhibits good vibration and shock resistance due to its high bond strength and unitizing properties. During aging tests at temperatures above 130°C, Structalit® 5801 actually gains bond strength. Adhesive exposure to transmission oil, biodiesel, and alcohol during aging resulted in minimal loss of bond strength. This is mainly due to the high degree of crosslinking and the low moisture absorption of this adhesive.
Structalit® 5801 can be dispensed from a 50 ml dual-chamber cartridge which is ideal for manual, short-run, or semi-automated production. This epoxy system is also available in sedimentation-stable bulk containers which can be used with meter-mix equipment for high volume production.
Structalit® 5801 is applied as potting to protect printed circuit boards in enclosures.
Flexible Conductive Epoxy from Panacol
Elecolit® 3647 is a new addition to Panacol’s extensive portfolio of electrically conductive epoxy systems. With a history of demonstrated success, this silver-filled conductive adhesive is particularly suitable for bonding with temperature-sensitive films or flex PCBs.
Elecolit® 3647 is a one-component, silver-filled conductive adhesive that adheres very well to plastics, including polyimide, PC, PVC, ABS, and FR4 board. When fully cured, the adhesive is very flexible with high peel strength, making it the perfect choice for use in applications subject to vibration, oscillation or rapid temperature changes. Elecolit® 3647 can be used for die attach applications and component assembly on flexible films and printed circuit boards. This conductive adhesive has utilization in printed and “in-molded” electronics, wearables, and the conductive attachment of semiconductor chips.
A major advantage of Elecolit® 3647 is it’s very easy handling and storage. The adhesive only needs to be stored refrigerated, not frozen! The single-component adhesive can be dispensed, and cures within minutes at temperatures as low as 100°C. This makes it possible to fixture semiconductors and create electrical connections in a single step.
Read more about our portfolio of electrically conductive adhesives
Download the technical datasheet for Elecolit® 3647
Bonding and contacting in one step: Small chips are fixed to flexible tracks with a conductive connection using Elecolit® 3647
New Panacol epoxy adhesive for bonding magnets
Structalit® 5858 is a modified, one-component epoxy resin adhesive that was developed specifically for bonding magnets into electric motors. Its high bond strength and impact resistance ensures reliable bonding.
Structalit® 5858 can be cured thermally in a conventional oven at temperatures from 100°C. It is also possible to use induction curing for faster polymerization and shorter curing cycles. The adhesive requires storage between 0-10°C, but its stable viscosity and reactivity allow it to be processed on the line at ambient temperature for up to seven days.
The Structalit® 5858 was developed by Panacol to expand its line of adhesives for electric motor assembly. After proper curing, Structalit® 5858 generates excellent adhesion to metals. With bond strength over 34 MPa on steel and aluminum, this adhesive creates reliable and high-strength bonds. Even at temperatures above 100°C, Structalit® 5858 continues to exhibit excellent superior bond strength, ensuring consistent performance during thermal stress. The high impact strength of this modified epoxy ensures that bonded components will not loosen or separate from operational vibration or external forces. Structalit® 5858 is particularly suitable for bonding magnets, such as the connection of half-shell magnets in stators, or permanent magnets on rotors.
Download the technical datasheet for Structalit® 5858
The adhesive marked in light blue shows exemplary magnetic bonding with Structalit® 5858 in an electric motor.
New biocompatible UV adhesive for soft plastics
Panacol has developed a new plastic bonder that is certified to USP Class VI biocompatibility standards for medical device assembly applications. Vitralit® UV 7030 features high elongation at break, excellent adhesion to difficult-to-bond plastics, and rapid curing under UV light.
The various material selections and pairings of flexible tubing and rigid connectors often create significant assembly challenges in high volume production. Materials used to create infusion lines, catheters, and similar medical devices may include TPU, TPE, PEN, polyamides, Pebax®, polycarbonate, ABS and PEEK. These thermoplastics and thermoplastic elastomers provide many desirable properties, but some combinations can be difficult to bond. After assembly, these materials are challenged by torsional stresses at the points of transition between the soft tubing and the hard connector. Panacol developed the adhesive Vitralit® UV 7030 to specifically address these complex issues.
Vitralit® UV 7030 is a one-component, solvent-free UV curable acrylic adhesive. It can be cured with light energy in the broad UV-A spectrum, or with LED systems that produce either 365 or 405 nm wavelength. This adhesive cures in seconds at layer thicknesses of a few 100 µm, ensuring high bond strength immediately after UV exposure. A key feature of Vitralit® UV 7030 is its high elongation at break, >250%, combined with good tensile strength. When exposed to black light, Vitralit® UV 7030 fluoresces, which enables visual process control. Vitralit® UV 7030 is certified to USP Class VI standards and suitable for typical sterilization processes including gamma, EtO and autoclave.
Download the technical datasheet: Vitralit® UV 7030
Tubes are bonded to connectors using Vitralit® UV 7030.
Panacol introduces new reworkable underfill adhesive
Panacol has developed a new reworkable underfill for consumer electronics. The reworkability and fluorescence despite its black color of the new Structalit® 5751 adhesive allows manufacturers to reduce both manufacturing costs and environmental impact by reusing electronic components mounted on PCBs.
Underfills serve the purpose of equalizing stresses between chip and substrate. Chips are attached directly to the interconnection points without intermediate elements. Stresses arise at the solder bumps when the electronic modules are heated and cooled during operation due to the different coefficients of thermal expansion of the substrates. Underfill technology was developed to counteract these mechanical influences.
Structalit® 5751 is a black, heat-curing, resin-based epoxy adhesive characterized by its low viscosity and linear flow behavior. These properties enable precise application. In addition to classic contact dispensing by means of a dispenser, the uncured properties of Structalit® 5751 also allow contactless dispensing for fast and precise placement of the adhesive. This underfill is has a low ion content and is ideally suited for electronic component packaging.
A typical feature of adhesives on PCBs is their black coloring, which is used to obscure proprietary features and for optical inspection. Optical measurement of an underfill is a common method used in the manufacturing process by manufacturers. But due to the dark chip, shallow layer thickness of the black adhesive and tight gap between the chip and the substrate, optical measurement is often difficult. Panacol has addressed this problem by incorporating an additional yellow shimmering fluorescence to the black coloration of Structalit® 5751. It can be stimulated by short wavelength light of <365nm. This makes it even easier for manufacturers to perform final inspections and speeds up production processes.
In addition to the performance and optical inspection capability of Structalit® 5751, Panacol offers another important property with its newly developed underfill: reworkability. This provides the ability to re-process or repair products after assembly. For manufacturers of electronic components, this challenge is becoming increasingly important as legislation and environmental associations push for the minimization of electronic waste. One starting point of this sustainable strategy is the reworkability and repairability of individual modules on printed circuit boards to counteract the scrapping of a complete component or module.
Structalit® 5751 can be strategically softened at specific adhesion points by applying temperatures above its glass transition temperature range of 150°C. The product becomes reworkable only when this critical temperature threshold is reached. The reworkability temperature does not reduce the protective function of the Structalit® 5751 during typical PCB processing. It withstands temperatures associated with reflow soldering and additional thermal curing cycles.
The current global shortage of chips and general electronic components in the automotive and consumer electronics sectors further highlights the significance of being able to reuse components. Reuse of components is not only a benefit to the environment, it has become essential to sustain current production processes due to supply chain shortages.
Download the technical datasheets:
Underfill Structalit® 5751 seen under normal daylight and yellow fluorescing under uv light.
Panacol-Elosol relocates to newly constructed facility
Vigorous growth has enabled Panacol-Elosol GmbH, manufacturer of industrial and specialty adhesives, to build a larger facility for its corporate headquarters. With double the space for offices, laboratories and production, up to 100 employees can now work at the new site. It is located in Steinbach near Frankfurt/Main Germany, within the new Steinbach industrial estate "Im Gründchen", close to the company’s former location.
The new building offers Panacol employees a contemporary work environment with more than 6,000 m2 space. The laboratories for research & development, application engineering and quality management are equipped with state-of-the-art technology that increases in-house analytical and testing capabilities. A larger production area with additional new equipment has increased manufacturing capacity and efficiency. The new facilities can be expanded to support further growth in the coming years.
Panacol provides customer-focused assembly solutions based on innovative adhesive technology. This includes products for structural bonding, protective coating and encapsulation, electrical and thermal conduction, gasketing, and temporary masking. With subsidiaries in France, USA, China and Korea, Panacol provides global product supply and technical support.
Served markets include automotive, aerospace, optics, consumer and industrial electronics, luxury packaging, appliance, and medical device assembly. Customised adhesive solutions are developed and manufactured at the Panacol sites in Steinbach Germany and in the United States.
Panacol-Elosol GmbH was founded in 1978 as a German subsidiary of the Swiss Panacol AG in Frankfurt. In 2008, Panacol was acquired by Munich-based Dr. Hönle AG, a leading global supplier of industrial UV equipment technology. As a member of the Hönle Group, Panacol is a knowledgeable and reliable provider of adhesives, coatings, and UV/LED curing equipment for OEM and contract manufacturers around the world.
Aerial view of the new Panacol headquarter building in Steinbach near Frankfurt, Germany
New epoxy adhesives cure at 60°C
Panacol has developed a range of new one component epoxy adhesives that cure at very low temperatures. These new adhesives were developed specifically for electronics applications and adhere very well to substrates with low surface energy.
With the adhesives Structalit® 5511, 5521 and 5531, a range of adhesives has been developed that exhibit a unique set of physical properties after reaching full cure. This permits optimizing the adhesive with various component geometries, substrates, and operating functions.
All three adhesives are single-component, epoxy resin-based adhesives and cure at just 60°C, making them particularly suitable for temperature-sensitive electronic components. Curing at higher temperatures will accelerate cure time and add additional strength to the bond.
Structalit® 5511 features a particularly low ionic content and is therefore especially suitable for use in electronics. Combining a high Young's modulus with an elongation at break of more than 8%, it ensures high adhesion to many substrates with additional shock and vibration resistance.
Structalit® 5521 is softer and more flexible after curing, allowing the adhesive to better compensate for stresses between substrates. Due to its very low modulus of elasticity, this adhesive is very well suited for potting or for the application of thicker adhesive layers.
As the third adhesive of the new epoxy technology, Structalit® 5531 has an extraordinary low coefficient of thermal expansion (CTE), yet is flexible enough to withstand drop and vibration tests. The incorporation of filler particles gives the adhesive extremely high resistance to mechanical and chemical influences.
These Structalit® adhesives from Panacol generate very high bond strength with materials typically used in the electronics industry. They can also adhere very well to LCP (liquid crystal polymer) and other high-tech plastics with low surface energy. All three adhesives possess high purity and low ion content which complies with international standards for electronic and microelectronic component assembly.
The new Structalit® 5511 is suitable for connector sealing (adhesive shown in light blue in the graphic).
Panacol introduces new high-performance frame-and-fill adhesives
Panacol has developed a new range of high-performance adhesives for frame-and-fill applications on printed circuit boards.
Frame-and-fill processes are used to protect highly complex areas on electronic circuit boards. In the first step, a highly viscous barrier – the so-called frame – is applied. In the next step, this area is quickly filled with lower viscosity filler material – the fill. With this precise process, areas on the circuit board can be protected from mechanical impact factors.The combination of frame-and-fill materials allows the application of minimum barrier and potting heights and cures to a homogeneous coating. Panacol's new frame-and-fill adhesives are perfectly matched so that the frame and fill areas can be optimally dispensed wet-on-wet without the still-liquid adhesives leading to undesired flowing on the PCB.
The frame material, Structalit® 5704, is a black, thermally curable and single-component epoxy. This frame and glob top compound features excellent bead stability and high glass transition temperature of 150°C up to 190°C, depending on the curing parameters and the layer thicknesses. When using Structalit® 5704, no bleeding effects occur. Due to the very low ion content of less than 20 ppm, Structalit® 5704 is suitable for chip encapsulation on electronic circuit boards.
As a fill material, Panacol has developed a range of adhesives with different rheological properties. The adhesives Structalit® 5717 to Structalit® 5721 are formulated with optimized flow behavior, so that the adhesives can be used on various chip and bonding wire geometries due to the differently adjusted viscosities. Since the fills have the same chemical base as the frame material, the excellent physical and chemical properties of high glass transition range, ion purity, temperature stability and minimal shrinkage behavior are also found in the fillls.
Once cured, Structalit® 5704 and the matching fill of the Structalit® 5717-5721 series form a black, opaque and scratch-resistant coating. These properties together with a temperature resistance of up to 200°C ensure maximum reliability.
Structalit® 5704 is applied as a stable "frame" and then filled with low-viscosity fill material to form a homogeneous protective coating of sensitive components
Smart system solution for needle bonding
A main field of application for adhesives in medical systems is needle bonding and syringe assembly in high volume production. Optimally matched processes are essential for reliable bonding. Panacol, Hönle and bdtronic partner to ensure that precise adhesive dosing, capillary flow and curing in seconds with UV light work hand in hand.
As the needles are produced in large quantities rapid and reliable bonding is essential. In addition to their mechanical bond strength, the adhesives used must allow high-precision production and permanent joining and must withstand various sterilization methods. Panacol’s UV curable Vitralit® adhesives exactly meet these requirements. Vitralit® adhesives are available in various viscosity ranges to perfectly fit the design of the needle hub and fill the gap between the hub and the needle. The material of the hub and needle also affects the choice of the adhesive: Many adhesives are UV-curing, which requires the use of transparent and UV-permeable materials. For materials that block UV light, such as polycarbonates, long-wave LED curable adhesives are recommended.
All Vitralit® adhesives recommended for needle bonding are solvent-free and certified USP Class VI and/or ISO 10993 for use in medical equipment. In addition, high needle extraction forces were measured with all needle bonding adhesives even after several sterilization cycles. For visual quality inspection, fluorescent versions of our medical grade adhesives are also available.
The choice of the adhesives requires a matching dispensing system for reliable and precise dispensing in a rapid production environment.
The high quality demands required for medical devices, as this needle bonding application, confirms the choice for bdtronic’s volumetric dispensing equipment. With the mini-dis solution provided by bdtronic, dispensing in microliter range is made easy, regardless of the adhesive viscosity. Thanks to the continuous volumetric dispensing, the dispensing is pulsation free ensuring optimal process speed, repeatability and accuracy.
Finally, the choice of the UV curing equipment depends on the adhesive and the wavelength which triggers polymerization. For needle bonding with Vitralit® products you can use either UV-A or visible LED light.
Due to a special LED assembly and an own optimized electric power supply, Hönle LED Powerline LC guarantees a high-intensive irradiation for fastest curing and shortest cycle times. In addition, the irradiation time can be selected in a range of 0.01 – 99.99 sec and thus precisely adapted to the process requirements.
Hönle LED Powerline heads have a compact design for an easy integration into any production line. The high-intensive, water-cooled LED-UV is suitable for clean room operation.
The UV adhesive bonding the needles into the needle hubs is being cured under uv light.
Watch "Needle Bonding" video:
New dual-curing potting compound for piezoceramics
Panacol is expanding its portfolio of dual-curing acrylic adhesives with the introduction of Vitralit® UD 8052 F. This material was developed for piezo actuators and sensors. It possesses a particularly high tear resistance for bonding ceramics and plastics.
Vitralit® UD 8052 F is a low viscosity, one-component UV curable adhesive. It is jettable, transparent, and fluoresces under UV light. Customized versions with different colors are available to facilitate improved process control. Its jet dispense capability makes high UPH (units per hour) values achievable, which is why Vitralit® UD 8052 F is the perfect choice for consumer electronics applications.
This potting compound can be cured in just a few seconds with UV light (320nm - 390nm) or visible light (405nm). The fluorescing adhesive allows in-line process control with short-wave light for maximum productivity. In areas that cannot be reached by light, Vitralit® UD 8052 F post cures with atmospheric moisture, and thus polymerizes reliably into a flexible potting and glob top compound.
Its high tear resistance after curing has been optimized for bonding ceramic components to plastic, compensating for the different expansion coefficients of the bonded materials. Thus Vitralit® UD 8052 F is particularly suitable as a protective coating and for applications subject to tensile and compressive stresses. As a potting compound, it features a low halogen content, it is flexible and offers protection against corrosion and other environmental influences.
Read more about adhesive application in electronics
Fluorescence testing of a strand protected with Vitralit® UD 8052 F on a piezo actuator.
Panacol and Hönle develop new system solution for filament winding processes
With the newly developed Vitralit® UD 1405 adhesive, Panacol has created an innovative adhesive system for fibre and filament winding. For high efficiency, Vitralit® UD 1405 can be applied during the winding process and immediately cured with high intensity LED curing systems from Dr. Hönle AG. This innovative winding process is extremely space and time-saving, and can produce significant processing cost savings.
Vitralit® UD 1405 can be used to wrap components such as hybrid rotor shafts for electric motors and high-voltage surge arresters. The adhesive-coated fibre-reinforced windings can be then be quickly cured with UV/visible light. This adhesive and curing system is ideal for Carbon or Glass Fibre filament winding associated with Carbon Fibre Reinforced Polymer (CFRP) or Glass Fibre Reinforced Polymer (GFRP) manufacturing processes.
Panacol’s Vitralit® UD 1405 is a transparent, solvent-free, one-component epoxy. Due to its low viscosity, Vitralit® UD 1405 has very good wetting properties. It can be cured in seconds by irradiation with UV (365nm) or Visible (405nm) light wavelengths. Depending on the fibre material and the wavelength used, layer thicknesses of several millimetres can be achieved exclusively by UV/Visible light curing. This epoxy can also be thermally cured after UV exposure to ensure that a complete cure is secured in areas shadowed from the UV light. For example, fibres or filaments can first be pulled through an adhesive bath, then wound onto the rotor or respective cylinder, and cured with UV or visible light. A secondary thermal cure will ensure that the layers of coated windings below the surface become fully cured.
For the most efficient UV curing system for fibre and filament winding processes, the LED Powerline AC/IC 820 HP from UV specialist Hönle is the perfect choice. With intensities of up to 16,000 mW/cm², this LED system ensures very fast curing. Its light emission window is available in two standard sizes, 82 mm x 20 mm and 122 mm x 20 mm, which can be extended without gaps by stringing together multiple modules. When developing the LED Powerline AC/IC 820 HP, special attention was paid to a slim design. This makes it ideal for use where space is at a premium, such as automated winding equipment.
The powerful LED Powerline AC/IC 820 HP can be powered and controlled using the optionally available LED powerdrive IC as a plug&play solution, or by using a customer supplied external power supply and PLC. This makes the LED Powerline an ideal solution for integrating high power LED curing systems into automated assembly processes.
After curing, Vitralit® UD 1405 is electrically insulating, shows minimal shrinkage and remains resistant at temperatures from -40° to 180°C. A glass transition temperature of over 130°C ensures reliable performance even under dynamic load at elevated temperatures.
The winding of a filament impregnated with Vitralit® UD 1405 is cured under UV LED light
New UV Adhesive for Decorations and Dome Coatings
Vitralit® UC 6685 was formulated by Panacol specifically for decorations on plastic, glass or metal. Due to its slight magnifying property, the transparent adhesive produces a high-quality image of the structures and illustrations underneath.
Vitralit® UC 6685 is a transparent, UV-curing adhesive based on epoxy resin. Being one-component the adhesive is easy to dispense. Its viscosity makes it suitable for decorative applications on flacons and bottles or for dome coatings, an elegant protective coating for key rings, lapel pins, buttons, name tags, pens and jewelry, for example.
Under UV light in the wavelength range from 320 nm to 390 nm, Vitralit® UC 6685 can be cured in just a few seconds, enabling a high cycle rate in the production process. The in-house UV and LED UV systems of Dr. Hönle are perfectly matched to the adhesive for particularly fast and easy curing under UV light.
After curing, Vitralit® UC 6685 is very hard and scratch-resistant, it is characterized by its brilliant transparency and does not yellow as it ages.
Adhesive drops for decoration on a glass flacon
Adhesives for Cell Contacting Systems and Battery Packs
Panacol has developed specially formulated UV adhesives that protect welded joints on cell contacting systems and battery packs of electric cars from corrosion. The flexible adhesives enable vibration-resistant connections and have a low ion content.
High-performance cell contacting systems (CCS), which combine individual lithium-ion battery cells for hybrid and electric vehicles to form battery packs, are often connected by welded strands or wires. To protect these welded joints from corrosion, Panacol has developed special low-ion UV adhesives that are applied as protective coatings. These adhesives provide additional mechanical support when subjected to vibrations and can compensate for thermal expansion of the different materials.
UV-curing adhesives Vitralit® UV 2113 and Vitralit® UV 2114 are characterized by very high adhesion to many materials and meet the requirements of the automotive industry in terms of media and temperature resistance. The rheological properties of both Vitralit® UV 2113 and Vitralit® UV 2114 can be adapted to individual customer requirements. Fluorescent adhesive variations for optical process control are also available.
In just a few seconds, these adhesives can be cured with light in the UVA or visible range. Both gas discharge lamps and LED spot systems can be used for curing. Perfectly matched to Panacol adhesives are the UV and LED UV curing systems from Dr. Hönle, for example the high-intensity LED Powerline AC/IC HP.
For complex CCS geometries with shadowed areas, dual curing Vitralit® UD 8050 is the perfect choice. After UV irradiation, this ion-pure acrylate adhesive post-cures in the shadowed areas by reacting with humidity in the air.
Biocompatible Adhesive Withstands High Heat Input
The epoxy resin based Vitralit® 1605 is particularly unique due to its high glass transition temperature and is therefore versatile for applications with high heat input. The biocompatible adhesive cures under UV light and is suitable for medical device assembly.
The one-component adhesive Vitralit® 1605 from Panacol is transparent and very easy to dispense. Its adhesion to glass and metal is excellent, which is why it can be used for fixing glass and rod lenses in endoscopes or for bonding lens stacks, for example.
The cationic Vitralit® 1605 can be cured under UV light in the wavelength range from 320 nm to 390 nm. It also features a thermal initiator that enables secondary curing of shadowed areas. The UV lamps from Dr. Hönle AG are well-matched for this adhesive, delivering fast and consistent curing processes.
When fully cured, Vitralit® 1605 is characterized by excellent chemical resistance and very low shrinkage. In addition, it has a very high glass transition temperature of 150°C and a low coefficient of thermal expansion. This provides the ability to bond components that require maximum stability during elevated operating temperatures. Furthermore Vitralit® 1605 can withstand the typical sterilization processes. Due to these characteristics, as well as its certification according ISO 10993-5, Vitralit® 1605 is especially suitable for bonding in medical technology.
Download technical data sheet
Steinbach/Taunus, 18 March 2020
New Thermally Conductive Adhesive for Heat Sensitive Components
The new Elecolit® 6607 adhesive from Panacol is thermally conductive and can be oven cured at temperatures as low as 80°C. It is characterised by excellent metal adhesion and is electrically insulating.
Elecolit® 6607 is an epoxy resin-based adhesive filled with aluminium oxide. It is a one-component adhesive and due to its flow characteristics, it can be applied by dispenser, screen printing or spatula.
Since Elecolit® 6607 cures at temperatures as low as 80°C, even heat-sensitive components can be bonded together. Curing at higher temperatures will shorten the curing time.
After curing, the light gray adhesive insulates electrically and provides excellent heat dissipation. Due to its properties, Elecolit® 6607 is particularly suitable for bonding metal components and heat sinks to electronic circuit boards.
New adhesive Elecolit® 6607 is thermally conductive and can be cured from temperatures of 80°C.
Steinbach/Taunus, 13 February 2020
New Autoclavable UV Coating
Vitralit® 2028 from Panacol is a new UV curable coating that is resistant to chemicals and is autoclavable. It is a flexible coating material that can be cured in two ways, UV or heat.
The transparent epoxy Vitralit® 2028 is easy to dispense because of its low viscosity. Nevertheless, it enables a clean edge finish without bleeding. It is therefore ideally suited as a flexible protective coating.
Vitralit® 2028 can be cured with light energy in the UV range from 320nm to 390nm. UV curing devices from the UV equipment manufacturer Dr. Hoenle are particularly suitable for an optimal UV curing process. The special feature of the adhesive is its thermal initiator, which allows secondary curing of shadowed areas using an oven.
The coating surface is very dry after UV curing, so coated components can be processed immediately. The final strength of the UV coating is achieved when the it cools down to ambient temperature. Once fully cured, Vitralit® 2028 is transparent and resistant to chemicals and is suitable for autoclaving. This material is ideal as a protective coating for wires in coil windings as well as other applications requiring protective coatings.
Download technical data sheet
Vitralit® 2028 is used as the coating of a coil winding to protect against chemicals.
Steinbach/Taunus, 20 January 2020
New UV Adhesive with Low Halogen Content
With Vitralit® UC 1536 Panacol is launching another low-halogen UV adhesive for the electronics industry. Due to its low ion-content, it is ideal for semiconductor production. The new very stable, high-gloss, transparent adhesive cures within a few seconds.
The adhesive Vitralit® UC 1536 is an epoxy-based adhesive, which hardens very quickly under UV-light. Due to its high viscosity, it is particularly suitable for applications that require dimensional stability within the production process.
When exposed to light energy in the UVA range from 320 to 390 nm, the Vitralit® UC 1536 adhesive can be cured within seconds. Panacol offers a broad line of suitable curing devices from Dr. Hönle that can create customized solutions for the processing of Vitralit® UC 1536. UV bonding and curing solutions are available for every application from a single source!
Vitralit® UC 1536 cures to an optically clear and high-gloss surface, which is very hard and scratch-resistant. Even at high operating temperature, the adhesive remains very clear and keeps its transparent brilliance. Characterized with a very low ion-content, Vitralit® UC 1536 is ideally suitable for semiconductors. A very successful application for this adhesive involves bonding glass lenses to CMOS sensors.
Individual parts of camera modules are fixed with adhesive such as Vitralit® UC 1536
Steinbach/Taunus, 15 November 2019
Fast Curing Epoxy Adhesive Enables High Efficiency Cosmetic Packaging
The new epoxy-based adhesive Vitralit® UC 6025 from Panacol optimizes automated assembly processes. It can be applied and cured very quickly due to its accommodating dispensing properties.
Especially designed for the cosmetics industry, Vitralit® UC 6025 has an optimal viscosity for gap-filling applications. The one-component epoxy adhesive is odourless and easy to dispense. Its controllability and fast curing properties make Vitralit® UC 6025 suitable for applications requiring a high performance.
Vitralit® UC 6025 can be cured with UV or visible light in just a few seconds. The adhesive curing process can be further optimized by using UV/LED curing equipment from Dr. Hönle. The fluorescing version of the adhesive, Vitralit® UC 6025 F, allows in-line process control for maximum productivity.
Once cured, the adhesive has high adhesion to ABS, aluminium and glass. These properties and lack of odour make Vitralit® UC 6025 ideal for applications in the cosmetics industry. Application examples include bonding lipstick applicators or bottle lids.
New epoxy adhesive Vitralit® UC 6025 is the perfect bonding solution for high volume production of plastic packagings
New Biocompatible Adhesive for Plastics Fluoresces Orange
A new orange fluorescent UV adhesive from Panacol is specially formulated for bonding plastics: Vitralit® 7311 FO is certified according to USP Class VI standards which makes it the perfect solution for bonding medical devices.
Vitralit® 7311 FO is a low viscosity, transparent acrylic adhesive that cures under UV or visible light. It offers very high bond strength to many plastics including PC, PVC, PMMA or ABS, and also to materials such as glass and stainless steel. Thanks to its very low viscosity and capillary flow characteristics, Vitralit® 7311 FO is suited for bonding large surfaces as well as applications with narrow gaps.
Under low intensity black light (365 nm wavelength), Vitralit® 7311 FO fluoresces orange. This allows in-line inspection for quality control. The bright fluorescence is highly contrasting with plastics possessing a natural blue fluorescence or color. Optimum curing results can be achieved with LED curing equipment with a wavelength of 405 nm, especially the UV-LED equipment Bluepoint LED eco from Hoenle. Bluepoint LED eco can be equipped with both wavelengths, serving both processes. Thanks to modern photo initiators Vitralit® 7311 FO can be cured – especially in high volume production – within seconds.
Once cured, Vitralit® 7311 FO is humidity and alcohol resistant. Vitralit® 7311 FO has been tested and certified according to USP Class VI standards. The product is compatible to common sterilization processes like autoclaving, gamma radiation, E-Beam or ETO and well suited for use in the assembly of disposable medical devices.
Vitralit® 7311 FO fluoreces orange.
Steinbach/Taunus, 26 August 2019
New Crystal-Clear UV Adhesive for Semiconductor Production
At this year’s BondExpo Panacol will present Vitralit® UC 1535, a new transparent adhesive specifically designed for use in electronics. It hardens with UV light within a few seconds and can be used for semiconductor production due to its low ion content.
The Vitralit® UC 1535 is an epoxy-based UV-curing adhesive that hardens very fast. It is easy to dispense and non shear-thinning. In just a few seconds, the adhesive can be cured with radiation in the UVA range from 320 to 390 nm. For a fast and efficient curing, the broad spectrum and UV/LED systems from Dr. Hoenle AG are highly recommended.
The adhesive was especially designed for the assembly and production of electronic and optomechanical components. For example, the new Vitralit® UC 1535 is being used to bond glass lenses in optical systems. Once cured the adhesive features a transparent, optically clear and brilliant surface, which is very hard and scratch-resistant. Vitralit® UC 1535 is non-yellowing and remains optically clear even when exposed to high temperatures. Because of its low ion content the adhesive can be used for semiconductor applications.
Visit us at the BondExpo in Stuttgart, Germany from the 7th to the 10th of October 2019 at booth 6420 in hall 6!
Vitalit® UC 1535 from Panacol is designed for the assembly and production of electronic and optomechanical components.
Eleco Produits – EFD to become Eleco Panacol – EFD
French company Eleco Produits – EFD, specialising in industrial adhesives, dispensing and uv curing equipment, and German based adhesives manufacturer Panacol-Elosol GmbH, are both members of the adhesives division within the Hoenle Group, headed by publicly listed company Dr. Hoenle AG. To better support the growth requirements of their global customers, and present a more unified product offering, Eleco Produits – EFD is changing its name to Eleco Panacol – EFD effective August 1, 2019. “With this decision we see synergies in marketing and global brand recognition for the Panacol Group”, explains Laurent Prevost, Managing Director of Eleco Panacol – EFD.
Eleco Produits – EFD has been specializing in the distribution of industrial adhe-sives and matching dispensing and curing equipment since 1974. Since the beginning, Eleco has been partnering with German adhesives manufacturer Panacol-Elosol, distributing uv, structural and conductive adhesives. Inhouse laboratories for quality control and adhesive applications allow in-depth testing and qualified consultation. Since 2008, Eleco has also been distributing matching uv curing equipment from new parent company Dr. Hoenle. To complement its all-in-one solutions, Eleco also provides dispensing equipment for its adhesives portfolio. Situated in the metropolitan Paris area, Eleco benefits from a central logistic hub. Effective quality control methods ensure high quality products, packaging and transport. Eleco is certified to ISO 9001 standards.
The focus of Eleco Panacol – EFD will remain on the sales of innovate industrial adhesives and equipment from its facility in Genevilliers/Paris. The organization’s management and team will remain intact.
Visit Eleco-Panacol website
Eleco Panacol - EFD in Paris area, France
New Optically Clear Adhesive
Panacol developed a new optically clear adhesive: Vitralit® 50004. The new adhesive is a one-component uv curable acrylic adhesive with ultra-low viscosity, which is used for bonding displays and laminating optics.
Vitralit® 50004 adheres specifically to a variety of substrates including coated glass, PET and other plastics and films. It possesses a very low viscosity that facilitates fast filling of cavities without air entrapment. The adhesives cures quickly with minimal shrinkage for less residual stress between substrates.
Large-surface bonding or lamination of displays can be optimized by using Hoenle’s high-performance and energy efficient LED Spot 100 curing system which is perfectly matched to the photoinitiators of Vitralit® 50004.The alignment of the LEDs of the Spot 100 ensures high intensity and homogeneous light distribution. The LED Spot 100 heads can be mounted together without gaps to match the size of the display being bonded.
Once cured, Vitralit® 50004 is very soft. Thermal stresses between dissimilar substrates can be neutralized without causing delamination. It’s high degree of flexibility enhances performance through repeated thermal excursions. The cured adhesive is optically clear and non-yellowing with excellent light transmission.
Download technical data sheet
LOCA adhesives from Panacol are the perfect solution for serial production of displays and touchscreens
New Panacol Adhesives Cure With UV/moisture
Panacol developed a variety of new adhesive products with low ion content which cure with uv light and moisture. These products were specially formulated for applications in the electronics and consumer electronics industry, where heat sensitive parts must be assembled.
Vitralit® UD 8050 is a one-component acrylic adhesive, which can be used as an encapsulant to protect electronic components on PCBs. Vitralit® UD 8050 can be cured with uv or visible light. Moisture postcuring ensures full cure in shadowed areas or deeper layers of the adhesive, which cannot be reached by light.
For specific requirements several versions of the adhesive are available: Vitralit® UD 8050 MV F allows enhanced flow control and focused dispensing on each component thanks to its shear-thinning behavior. Its low ion content prevents cor-rosion on electronic components. For superior process control Vitralit® UD 8050 MV F contains a fluorescent marker.
For jetting, the low viscosity version Vitralit® UD 8050 LV is the perfect solution. Thanks to its easy dispensing and fast curing Vitralit® UD 8050 LV is very conven-ient for applications in the production of consumer electronics where a high throughput is needed.
By default, the adhesive is transparent, but it is also available in blue or fluorescing versions. Other colors are available on request.
Blue uv-moisture curing adhesive is used as encapsulant for electronic components
Tangent Industries Inc. to become Panacol-USA Inc.
US adhesives and coatings manufacturer Tangent Industries Inc., based in Torrington, Connecticut and German based adhesives manufacturer Panacol-Elosol GmbH, are both part of the adhesives division within the Honle Group. The head of the Honle Group is the publicly listed company Dr. Hoenle AG. To better support the growth requirements of their global customers, and present a more unified product offering, Tangent Industries Inc. is changing its name to Panacol-USA Inc. effective October 1st, 2018. Moreover, Panacol-Elosol will gradually assume full ownership of the new Panacol-USA within a 5 year span. “With this decision we see synergies such as global marketing and to provide adhesive products under one brand to our worldwide acting customers”, explains Florian Eulenhöfer, Managing Director of Panacol-Elosol GmbH.
Tangent Industries Inc. has been specializing in the development and production of UV curing acrylic adhesives and coatings since 1994. Panacol was the distributor for Tangent products outside the Americas since the very first day. The focus of Panacol-USA Inc. will remain on the development, production, and sales of innovate UV acrylic adhesives and coatings from its facility in Torrington. The organization’s management and team will remain intact.
Panacol-Elosol GmbH and Panacol-USA Inc., both members of the global Hoenle group, are leading suppliers of industrial adhesives, with a broad product range that includes UV curable adhesives and coatings, structural epoxies and conductive materials for electronics assembly. Panacol-USA Inc. is also a reliable provider of UV/LED processing systems in the Americas, designed and manufactured by Dr. Hoenle AG, a global technology leader of industrial UV curing devices and systems.
Visit website panacol-usa.com
Panacol-USA Inc. in Torrington, Connecticut