Electronic Component Potting
Electronic components inherently require protection from moisture and mechanical damage. For this reason, they are typically sealed with materials offering protective properties. Components such as capacitors, switches, and relays are typically designed with shallow cavities for containment, so that low viscosity potting materials may be dispensed quickly during automated production.
Panacol offers single component, light curable potting materials of the Vitralit® brand, or thermally curing potting compounds of the Structalit® line. Both adhesive brands are specifically formulated to act as barriers against contamination, chemicals, moisture, and handling damage. These materials dispense easily, cure quickly, and provide a protective surface that is dry and tack-free. Panacol’s broad selection of potting materials bond to a variety of substrates including ABS, nylon, polycarbonate, and plated metals.
Adhesives of the Vitralit® line are light curable potting materials. They are single component and solvent-free, and are easily dispensed from automated valve dispensing systems. A wide range of viscosities are available to meet component configuration and processing challenges. When cured, these materials exhibit dry, tack-free surfaces that resist contamination from airborne particulates and handling. Light curable materials are available with a secondary moisture or thermal cure catalyst in the event that shadowed areas exist in the potting field.
LED curable adhesives are included in Panacol’s product selection for electronic component potting and encapsulating. These adhesives fully cure in fractions of a second under low intensity UV or Visible light. They are ideal for use with LED light curing units; depending on the irradiation surface, Hoenle's floodlights are particularly suitable.
Structalit® adhesives are solvent free single or two-component adhesives. They are mostly based on epoxy resin and can be cured at room temperature or by exposure of heat. For heat-sensitive components low temperature curing adhesives are available.
Electronic components on a PCB are shielded from damage and moisture with fluorescing uv potting compound Vitralit® UD 8060 F, cured with a Hoenle Spot 40 IC
Download brochure:
View the potting products listed below for a possible candidate for your application. Please contact Panacol to confirm your product selection and to secure additional application assistance, including samples and process recommendations. New from Panacol are single component epoxy adhesives that cure at low temperatures (60oC). These products are ideally suited for potting temperature sensitive components.
| Potting materials: | Viscosity [mPas] | Base | Curing* | Properties |
|---|---|---|---|---|
| Vitralit® 1600 LV | 3,000-5,000 | epoxy |
UV secondary heat cure |
Very high Tg low water absorption low ion content very high chemical resistance |
| Vitralit® 1650 | 3,000-5,000 | epoxy | UV |
Electronic grade low ion content suitable for chip protection UL94 HB test passed |
| Vitralit® 1671 | 9,000-14,000 (Rheometer, 10s^-1) | epoxy |
UV secondary heat cure |
Stable frame compound high ion purity electronic grade adhesive high temperature conductivity low water absorption UL94 HB test passed |
| Vitralit® E-VBB-1 | 1,300 - 1,600 (Rheometer, 25 °C, 10s^-1) | acrylate | UV/VIS |
High peel strength; Optically clear; Outstanding flexibility; Excellent elongation; Resistant to moisture |
| Vitralit® UD 5180 | 4,000-6,000 | epoxy |
UV secondary heat cure |
Perfect solution for bonding flexible circuit paths resistant to reflow processes grey color |
| Vitralit® UD 8050 | 8,000-11,000 (Rheometer, 25 °C, 5s-1) | acrylate |
UV VIS secondary moisture cure |
Isocyanacrylate; fast moisture post-curing in shadowed areas; easy to dispense with jet or dispenser e.a.; resistant to moisture; compatible with flux |
| Vitralit® UD 8060 F | 6,000 (Rheometer, 25 °C, 10s-^1) | acrylate |
UV VIS secondary moisture cure |
Isocyanacrylate; Fast moisture post-curing in shadowed areas; High elongation; High adhesion to plastics and metals; Resistant to high temperature and humidity |
| Structalit® 5521 | 1,200-2,000 (Rheometer, 25°C, 10s^-1) | epoxy | thermal at 60°C |
Non-conductive Outstanding adhesion to high performance plastics (LCP, PBT) High purity Electronic grade standard Flexible |
| Structalit® 5531 | 5,000-10,000 (Rheometer, 25°C, 10s^-1) | epoxy | thermal at 60°C |
Non-conductive Outstanding adhesion to high performance plastics (LCP, PBT) High purity Electronic grade standard Good mechanical stability Good chemical resistance |
| Structalit® 5800 | 7,000-15,000 mix (LVT, 25°C, Sp. 4/30 rpm) | 2-part epoxy | thermal, room temperature |
High temperature resistance short pot life fast application |
| Structalit® 5801 | 12,000-22,000 mix, 10,000-20,000 part A, 18,000-29,000 part B, (Rheometer, 25 °C, 10s^-1) | 2-part epoxy | thermal, room temperature |
Black color Excellent oil, chemical and moisture resistance Low shrinkage Low water absorption Good adhesion to metal, glass and plastics |
| Structalit® 5802 | 40,000-65,000 mix (Rheometer, 25°C, 10s^-1) | 2-part epoxy | thermal, room temperature |
Dark grey color Excellent oil, chemical and moisture resistance Low shrinkage Low water absorption Good adhesion to metal, glass and plastics Flame classification based on UL 94 HB |
| Structalit® 5810-1 | 3,000-4,000 mix (LVT, 25°C, Sp. 4/30 rpm) | 2-part epoxy |
thermal room temperature |
Very high adhesion to PC resistant to moisture and chemicals |
| Structalit® 5894 M | 20,000-30,000 (Rheometer, 25 °C, 20s ^-1) | epoxy | thermal |
Black color excellent flow properties filling material for frame and fill applications on PCBs, very high resistance to heat and chemicals |
*UV = 320 - 390 nm VIS = 405 nm
To download the technical datasheets (TDS) please click on the adhesive name.