Attaching Components on PCBs

Before soldering, chips or SMDs (surface mounted devices) are often attached to the PCB (printed circuit board) with UV-curing adhesive. This allows, for example, several chips or other components to be glued onto on a circuit board within just a few seconds to prevent their falling or sliding out of position on the PCB. The secured chips can then be reflow-soldered in a single work step, which saves time and speeds up production.

Panacol’s adhesives for SMD assembly have been developed specially to cure rapidly at exposure to heat or under UV light. Once cured, the adhesives in the table below are short-term temperature-resistant and therefore suitable for holding components before and during reflow soldering onto PCBs.

On request these adhesives are also available in red colour or with fluorescent pigment to facilitate quality and application monitoring. Their red colour or fluorescence makes the adhesive clearly visible to allow the bond quality of every component to be easily inspected also in mass production. Especially the red stain creates a clear contrast to the usually green PCBs.

Adhesive for attaching SMDs on PCBs

UV-curing adhesives secure components on PCBs

The table below lists a selection of Panacol adhesives that are suitable for holding components on PCBs and for reflow soldering. Further products and custom solutions are available on request.

To download the technical datasheets (TDS) please click on the adhesive name.

Adhesive Viscosity [mPas] Base Curing* Properties
Vitralit® 6104 VT 80,000-90,000 (LVT, 25°C, Sp. 4/6 rpm); 8,000-17,000 (Rheometer, 25°C, 10s^-1) acrylate UV
secondary heat cure
Very high adhesion to metals and sintered materials
ideal for bonding large components on circuit boards (corner bonding)
Vitralit® UD 2018 11,000-25,000 (Rheometer, 25°C, 10s^-1) epoxy UV
secondary heat cure
Resistant to temperature cycles
low shrinkage
low thermal expansion coefficient
red color
pink fluorescent
Vitralit® UV 2115 20,000-30,000 (Rheometer, 25°C, 50s^-1) acrylate UV
Acrylate hybrid
superior strength
low thermal expansion
low shrinkage
impact resistant
resistant to soldering stress
stable and high viscous
Structalit® 3060 N 4,000-8,000 (Rheometer, 25 °C, 10^s-1) epoxy thermal non-conductive
high flexibility
very fast curing
very low ion content
Structalit® 5604 25,000-40,000 (Rheometer, 25 °C, 10s^-1) epoxy thermal Fast curing
red color
fixing components on PCBs
SMD applications
Structalit® 5606 F 22 000 - 30 000 (LVT, Sp. 4/6 rpm) Epoxy Thermal 1part epoxy, fluorescing bluish
Fast curing at low temperatures
High shock resistance
Short time resistant to soldering temperatures up to 270° C
Structalit® 5610 22,000-40,000 epoxy thermal very fast curing even at low temperatures
high temperature resistance
red color
Structalit® 5705 7,000-12,000 epoxy thermal
Black color, yellow fluorescent, reworkable above 150°C, jettable, low in halogens, very suitable as edge bonding adhesive
Vitralit® UD 8055 5,000-8,000 (Rheometer, 25°C, 10s^-1) acrylate UV
moisture cure
High Tg
Fast curing
Compatible with flux
Low ion content
Vitralit® UD 8056 3,000-6,000 (Rheometer, 25°C, 10s^-1) acrylate UV / VIS High Tg, fast curing
Compatible with flux
Low ion content
Passed UL94 HB test

*UV = 320 - 390 nm