Frame-and-Fill Adhesives

Frame-and-fill processes are used to protect highly sensitive areas or sensitive information on electronic circuit boards. In the first step, a high-viscosity barrier – the so-called frame – is applied. In the next step, this area is filled with low-viscosity filler material – the fill. Frame and fill offers two primary advantages: Barrier and potting (fill) heights can be kept to a minimum, and the frame and fill combine to form a homogenous protective coating.  With this precise process, specific areas on the PCB can be protected from mechanical and environmental impact factors. 

Structalit® frame-and-fill adhesives from Panacol are formulated to be completely compatible with each other. Both materials can be optimally dispensed wet-on-wet. The highly thixotropic frame prevents the lower viscosity fill from migrating into undesired areas on the PCB. The frame and fill are then cured in a single step.

Structalit® brand frame-and-fill adhesives are black, one-component epoxy resin adhesives that cure thermally. They have a high glass transition temperature, are extremely scratch and chemical resistant, and do not bleed. 

Panacol also offers Vitralit® brand adhesives, which are translucent, UV-curing epoxy-based frame-and-fill materials. These UV-curable adhesives can likewise be dispensed wet-on-wet and then cured in seconds under UV or UV LED light. These UV epoxy resins are equally robust against temperature and environmental influences. Some of these UV-curable adhesives can be thermally post-cured to ensure that the adhesive also polymerizes reliably in shadowed areas or when applied in thicker layers. The advantage of UV-curable frame-and-fills is their fast curing at low temperature. Rigid and flexible circuit boards containing temperature-sensitive components can be processed in-line, in a continuous production flow. 

Panacol offers frame and fill adhesives with a low ion content with less than 20 ppm, making them  particularly suitable for chip encapsulation on electronic circuit boards. 

Adhesives for dam and fill applications

A stable "frame" is filled with low-viscosity fill material and results in a homogeneous protective coating of sensitive components

In the following tables you will find a selection of Panacol adhesives suitable for Frame&Fill applications. Other products or customized solutions are available on request. Technical data sheets can be downloaded by clicking on the adhesive name.
 

Frame-and-Fill adhesives for semiconductor applications (< 20 ppm)

Adhesive Application Viscosity [mPas] Base Curing Properties
Structalit® 5704 Frame-material for Frame&Fill 60,000-100,000 epoxy thermal Black color
stable frame, suitable in combination with fills Structalit 5717-5722
Structalit® 5717 Fill-material for Frame&Fill 3,000-8,000 epoxy thermal Very good flowability
High glass transition temperature
No bleeding
Very low ionic content (<10ppm)
Suitable for semiconductors
Structalit® 5719 Fill-material for Frame&Fill 7,000-11,000 epoxy thermal Very good flowability
High glass transition temperature
No bleeding
Very low ionic content (<10ppm)
Suitable for semiconductors
Structalit® 5720 Fill-material for Frame&Fill 10,000-15,000 epoxy thermal Very good flowability
High glass transition temperature
No bleeding
Very low ionic content (<10ppm)
suitable for semiconductors
Structalit® 5721 Fill-material for Frame&Fill 15,000-20,000 epoxy thermal Very good flowability
High glass transition temperature
No bleeding
Very low ionic content (<10ppm)
Suitable for semiconductors

Frame-and-Fill adhesives for electronics applications (< 900 ppm)

Adhesive Application Viscosity [mPas] Base Curing Properties
Structalit® 5891 T Frame-material for frame&fill 80,000-150,000 epoxy thermal Black color
stable frame material, can be applied wet-in-wet with filling material, suitable for frame stacking
stable edges
resistant to shocks
Structalit® 5791 Fill material for frame&fill 100,000-150,000 epoxy thermal
Structalit® 5893 Fill material for frame&fill 6,000-10,000 epoxy thermal Black color
excellent flow properties
filling material for frame&fill applications
high resistance to heat and chemicals
certified to ISO 10993-5 standards
Structalit® 5894 Glob top encapsulation
Encapsulation of electronic components
Bonding of electronic components
Fill material for frame&fill
45,000-55,000 epoxy thermal Black color
excellent flow properties
filling material for frame and fill applications on PCBs,
very high resistance to heat and chemicals

UV-curable Frame-and-Fill adhesives (< 20 ppm)

Adhesive Application Viscosity [mPas] Base Curing* Properties
Vitralit® 1671 Frame material for frame & fill applications 9,000-14,000 epoxy UV
secondary heat cure
Stable frame compound
high ion purity
electronic grade adhesive
high temperature conductivity
low water absorption
Vitralit® 1650 Fill for frame&fill 6,000-9,000 epoxy UV Electronic grade
low ion content
suitable for chip protection
Vitralit® 1657 Fill for frame&fill 5,000-15,000 epoxy UV Low ion content
excellent chemical resistance
low water absorption
suitable for covering open bonded chips
Vitralit® 1680 Fill for frame&fill 5,000-8,000 epoxy UV Very high resistance to heat and humidity
electronic grade adhesive
low ion content
suitable for chip protection
Vitralit® 1691 Fill for frame&fill 20,000-40,000 epoxy UV
secondary heat cure
black color
high ion purity
electronic grade adhesive
high temperature resistance
fast surface curing with UV light

*UV = 320 - 390 nm