Glob Top Sealing Compound

Sealing compounds and encapsulants are often used in electronics as so-called glob tops to protect electronic components. They protect components from moisture, dust, dirt and solvents. Glob tops also protect sensitive components from mechanical strain and scratching.

All Panacol sealing compounds and encapsulants are made without solvent and many have a low ionic content of less than 10 ppm Na+, K+, Cl- and Br-. They therefore provide perfect protection from internal corrosion and reduce local voltaic coupling.

Many sealing compounds are UV-curing, allowing rapid setting in just a few seconds. This makes them suitable for encapsulating components in fully automated high-volume production.
Thermally curing sealing compounds, on the other hand, have the advantage of curing even in shaded areas that the UV light cannot reach. Glob tops with black pigmentation, which are used as covers or coatings, can normally only be heat-cured.

After curing, all glob top sealing compounds withstand short-term temperatures of up to 280°C and remain unaffected by reflow processes. Panacol’s glob top adhesives are easy to process, highly flexible and have a high peel and shear strength.

Glob tops made from black epoxy adhesive material.

The table below lists a selection of sealing compounds suitable for glob tops. Further products and custom solutions are available on request.

To download the technical datasheets (TDS) please click on the adhesive name.

Glob top Application Viscosity [mPas] Base Curing* Properties
Vitralit® 1600 LV attaching components on PCBs
conformal coating
encapsulation of electronic components
chip encapsulation
potting material
automotive, aerospace
smart card
5,000-6,000 epoxy UV
thermal
Very high Tg
low water absorption
low ion content
very high chemical resistance
Vitralit® 1650 glob top encapsulation
conformal coating
encapsulation of electronic components
chip encapsulation
potting material
automotive, aerospace
smart card
6,000-9,000 epoxy UV Electronic grade
low ion content
suitable for chip protection
Vitralit® 1657 glob top encapsulation
conformal coating
encapsulation of electronic components
chip encapsulation
potting material
attaching components on PCBs
SMD assembly
display sealing
120,000-130,000 epoxy UV Low ion content
excellent chemical resistance
low water absorption
suitable for covering open bonded chips
Vitralit® 1671 glob top encapsulation
conformal coating
encapsulation of electronic components
chip encapsulation
potting material
attaching components on PCBs
SMD assembly
display sealing
smart card
250,000-300,000 epoxy UV
thermal
Stable dam compound
high ion purity
electronic grade adhesive
high temperature conductivity
low water absorption
Vitralit® 1680 glob top encapsulation
conformal coating
encapsulation of electronic components
chip encapsulation
potting material
smart card
6,000-9,000 epoxy UV Very high resistance to heat and humidity
electronic grade adhesive
low ion content
suitable for chip protection
Vitralit® 1688 glob top encapsulation
conformal coating
encapsulation of electronic components
chip encapsulation
potting material
smart card
3,000-4,000 epoxy UV Excellent flow properties and leveling
electronic grade adhesive
low ion content
suitable for chip protection
excellent resistance to heat and humidity
Vitralit® 1691 glob top encapsulation 280,000-310,000 epoxy UV
thermal
Black color
high ion purity
electronic grade adhesive
high temperature resistance
fast surface curing with UV light
Vitralit® UD 5180 glob top encapsulation
attaching components on PCBs
conformal coating
encapsulation of electronic components
SMD assembly
plastic bonding
potting material
automotive, aerospace
18,000-23,000 epoxy UV
thermal
Yellowish colour
perfect solution for bonding flexible circuit paths
optional thermal post-curing
resistant to reflow processes
grey color
Structalit® 5891 glob top encapsulation
plastic bonding
SMD assembly
300,000-400,000 epoxy thermal Black color
fast curing at low temperatures
impact resistant
Structalit® 5891 T glob top encapsulation
SMD assembly
attaching components on PCBs
80,000-150,000 epoxy thermal Black color
stable frame mat.
can be applied wet-in-wet with filling material (e.g. Structalit® 5893)
stable edges
resistant to shocks
Structalit® 5892 glob top encapsulation
SMD assembly
200,000-300,000 epoxy thermal black
Structalit® 5893 glob top encapsulation
SMD assembly
medical technology
needle bonding
6,000-10,000 epoxy thermal Black color
excellent flow properties
filling material
high resistance to heat and chemicals
certified to ISO 10993-5 standards
Structalit® 5894 glob top encapsulation
encapsulation of electronic components
SMD assembly
automotive, aerospace
potting material
45,000-55,000 epoxy thermal Black color
excellent flow properties
filling material
very high resistance to heat and chemicals
Structalit® 8838 attaching components on PCBs
encapsulation of electronic components
SMD assembly
6,500-7,500 epoxy thermal Black color
flexible potting compound
excellent flow properties

*UV = 320 - 390 nm