Adhesives for Applications in Optoelectronics

Optoelectronics comprises all products and processes that enable the conversion of electrical signals into optical signals and vice versa. 

Special adhesives are used to manufacture optoelectronic products. For example, optically transparent and non-yellowing adhesives are used as glob tops for diodes or LEDs. Panacol products are filled with special nanoscale filler particles, which have the advantage that they do not impair the optical properties and at the same time greatly improve the mechanical properties of the adhesive.

Panacol offers various epoxy resin-based adhesives specifically for fixing and aligning photodiodes and optical fibers for recording optical signals.

All adhesives exhibit low thermal expansion and stress on the underlying fine electronics, as well as good resistance to chemicals and the influence of media. In addition, the properties of the adhesives for optoelectronics are designed to have low shrinkage and low outgassing.

For small LEDs, adhesives are used both to attach the LED modules to the circuit board (red adhesive) and to encapsulate the chips with transparent adhesive (shown here in blue)

The table below lists a selection of adhesives that are suitable for applications in optoelectronics. Further products and custom solutions are available on request.

To download the technical datasheets (TDS) please click on the adhesive name.

Adhesive Application Viscosity [mPas] Base Curing* Properties
Vitralit® 1605 encapsulation of electronic components
optical cement
lens bonding cement
glass bonding
potting material
200-400 (LVT, 25°C, Sp. 2/30 rpm) epoxy UV
secondary heat cure
low shrinkage
low heat expansion
very high tg
excellent chemical resistance
certified to ISO 10993-5 standards
Vitralit® 1527 optical cement
lens bonding cement
glass bonding
potting material
600-1,250 epoxy UV Very high tg
low attenuation
high transmission
high chemical resistance
nanostructured fillers
Vitralit® 1528 optical cement
lens bonding cement
glass bonding
potting material
350-850 epoxy UV
secondary heat cure
low attenuation
very high Tg
Vitralit® UC 1618 optical cement
lens bonding cement
500-1,000 epoxy UV
secondary heat cure
high glass transition temperature
high chemical resistance
transparent
low thermal expansion
Vitralit® UC 1619 optoelectronics
lens bonding cement
LED encapsulation
3,000-5,500 epoxy UV
secondary heat cure
low ion content
non-yellowing
low thermal expansion

*UV = 320 - 390 nm